Under CopyrightKrauel, ChristopherChristopherKrauelWeishäupl, LauraLauraWeishäuplPfeffer, MarkusMarkusPfeffer2022-03-1319.5.20162016https://publica.fraunhofer.de/handle/publica/39192810.24406/publica-fhg-391928This presentation deals with a procedure to track the current equipment state and to identify underperforming parameters. The approach concentrates on the autonomous classification of different process variable types which are defined by particular variable behaviors and the investigation of specified statistical feature extraction methods for every respective class. Also the computation of the Equipment Health Factor (EHF) is presented. The expected benefit of the implementation of an EHF application is the optimization of lot and wafer measurement sampling.enmonitoringEquipment Health Factor (EHF)semiconductorcondition monitoringkey feature extraction670620530presentation