Schönfelder, S.S.SchönfelderBagdahn, J.J.BagdahnBaumann, S.S.BaumannKray, D.D.KrayMayer, K.K.MayerWilleke, G.G.WillekeBecker, M.M.BeckerChristiansen, S.S.Christiansen2022-03-102022-03-102006https://publica.fraunhofer.de/handle/publica/351823Laser technologies are used in a wide range of process steps in solar industry. In this paper novel laser dicing technologies like LaserMicroJet® and Laser Chemical Etching (LCE) are investigated and compared to standard dry laser and sawin g process. It is shown that standard laser technology causes large flaws in the samples reducing the strength drastically. Different strength of front and back side of samples of LaserMicroJet® and Laser Chemical Etching are investigated by Raman spectroscopy and EBSD (Electron Backscattering Diffraction). It is shown that a layer of molten and solidified material induces stress in the sample surface reducing the strength of samples. In a second investigation different laser techniques are used for edge isolation on wafer samples. The evaluation of strength shows, that there is a significant influence of used grooving technology on the scattering of samples resulting in different strength behavior.endefectlaser processingstrengthresidual stress531620conference paper