Metasch, R.R.MetaschRoellig, M.M.RoelligRoehsler, A.A.RoehslerBoehm, C.C.BoehmWolter, K.-J.K.-J.Wolter2022-03-122022-03-122013https://publica.fraunhofer.de/handle/publica/38115910.1109/EuroSimE.2013.65299702-s2.0-84880975907The paper presents low cycle fatigue results and properties as measured by small solder joints in a shear test setup. These symmetrical triangle experiments were performed at 25 °C by the variation of the specimen's displacements and the solder joint materials. The displacements varied between 2 m and 8 µm to get strains up to 2 % and stresses up to 40 MPa. The used solder ball alloys are SnAg3.5, SnAg3.0Cu0.75 and SnPb36. The strain rate was close to 1E-2 per second.en620conference paper