Under CopyrightLinz, TorstenTorstenLinzKallmayer, C.C.Kallmayer2022-03-1019.12.20132005https://publica.fraunhofer.de/handle/publica/34811010.1109/ISWC.2005.1910.24406/publica-r-3481102-s2.0-33845335200This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.enwearable electronicelectronic in textileintegrationpackaginginterconnectionembroideryencapsulationsmart textileintelligent textileembroidered interconnectionconductive threadwashabilityflexible substratemicrointegrationreliabilitydesign rules621conference paper