Lin, Y.-C.Y.-C.LinFroemel, J.J.FroemelSharma, P.P.SharmaInoue, A.A.InoueEsashi, M.M.EsashiGeßner, ThomasThomasGeßner2022-03-112022-03-112011https://publica.fraunhofer.de/handle/publica/37374210.1109/MEMSYS.2011.57344732-s2.0-79953778082In this study, for the first time we successfully bonded Si substrates with sputtered Zr-Al-Cu-Ni metallic glassy material. The surface pre-treatment with formic acid vapor plays a remarkable function for oxides removal before bonding. Metallic glasses have fundamentally glassy structure and exhibit a Newtonian viscous flow in the supercooled liquid region. The polymer-like plastic fluidity performs superior wettability which improves interfacial integrity. This paper introduces a unique functional material and reveals its high potential for MEMS bonding application.enconference paper