Aswendt, P.P.AswendtSchmidt, C.-D.C.-D.SchmidtZielke, D.D.ZielkeSchubert, S.S.Schubert2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/337421en620670HNDT solution for MEMS testing on wafer levelconference paper