Belguanche, AmalAmalBelguancheSchumacher, AxelAxelSchumacherDesch, NikolaiNikolaiDeschBenachour, AbdulmonaimAbdulmonaimBenachourBöttcher, JuliusJuliusBöttcherDietrich, GeorgGeorgDietrichPflug, ErikErikPflugSpies, IrinaIrinaSpiesMeyer, PeterPeterMeyerFolkmer, BerndBerndFolkmerKnappmann, StephanStephanKnappmannFarber, PeterPeterFarberGrabel, JensJensGrabelLake, Markus K.Markus K.LakeDehé, AlfonsAlfonsDehé2026-02-022026-02-0220229783800759910https://publica.fraunhofer.de/handle/publica/5053322-s2.0-85190680558Aim of this investigation is to determine the spacial and temporal heat distribution inside the bonding zone and in the adjacent components during reactive bonding by mathematical modelling and numerical simulation to find the optimal reactive multilayer system (RMS) and solder system for the respective bond task. Thermal 2D simulations for RMS foils based on Ni/Al and Zr/Al as well as thermal and stress simulations for RMS foils with adjacent components have been performed. Therefore, temperature and concentration dependent data of the used materials have been provided, and time steps and grid size have been optimized. In parallel, RMS foils have been fabricated, and reaction enthalpies, reaction front velocities and temperatures have been experimentally measured. By thermal 3D simulations, the solder melting times during reactive bonding of industrial relevant silicon devices with different geometrical sizes and variating RMS foil thicknesses have been calculated. Reactive bonding experiments with silicon test chips with the same sizes and RMS foils have been performed, and the bond quality has been analyzed. The predicted solder melting times could be experimentally verified.defalseconference paper