Werner, E.E.WernerKretzschmar, S.S.KretzschmarBonati, G.G.BonatiEberhardt, R.R.Eberhardt2022-03-112022-03-112009https://publica.fraunhofer.de/handle/publica/36550110.1117/12.8099782-s2.0-65649112497For mounting FAC lenses to diode lasers a new technology is introduced. Solder jet ball bumping is demonstrated to have the potential to replace conventional mounting technologies like adhesive bonding. The advantage of this method is a thermally and mechanically stable connection of micro optics and laser without drawbacks of outgasing and sensitivity to UV. The reached accuracy is within the range of one micrometer.en620conference paper