Under CopyrightSchröder, HenningHenningSchröderBrusberg, LarsLarsBrusbergArndt-Staufenbiel, N.N.Arndt-StaufenbielTekin, TolgaTolgaTekin2022-03-112025-10-282022-03-112009https://publica.fraunhofer.de/handle/publica/364173https://doi.org/10.24406/h-36417310.24406/h-364173We introduce new optical coupling elements for electrical-optical circuit boards, sensors and to bridge the growing field of nano-photonics to the micro-photonic periphery. It is a photonic packaging technology using thin glass foils. Novel innovative features are added to this technique to leverage its generic usage.de621presentation