Low temperature wafer bonding technology for RF based MEMS devices

Haubold, M.M.HauboldFigur, S.S.FigurSchoenlinner, B.B.SchoenlinnerKurth, SteffenSteffenKurthGeßner, ThomasThomasGeßner2022-03-122022-03-122013https://publica.fraunhofer.de/handle/publica/382194enLow temperature wafer bonding technology for RF based MEMS devicesconference paper