Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps

Hutter, M.M.HutterHohnke, F.F.HohnkeOppermann, H.H.OppermannKlein, M.M.KleinEngelmann, G.G.Engelmann2022-03-102022-03-102004https://publica.fraunhofer.de/handle/publica/34461910.1109/ECTC.2004.1319314en621Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumpsconference paper