Trunk, R.R.TrunkSchmid, H.H.SchmidSchneider, C.C.SchneiderPfitzner, L.L.PfitznerRyssel, H.H.RysselBernhardt, H.H.BernhardtMarx, E.E.Marx2022-03-092022-03-092002https://publica.fraunhofer.de/handle/publica/33994610.1109/ASMC.2002.1001585Scratching wafers coated with the commonly used layer materials in semiconductor processing generates a significant large number of particles during loading or unloading with a misaligned handling system. On bases of the particle data, estimated with the experimental setup, a prototype to be integrated into a SVG vertical production furnace was designed. Safety features ensured safe operation of the HandMon system and the production furnace. E-monitoring and standardized file format lead to simple use. The HandMon system executes several tasks and leads to economic benefits: · Monitoring of the minienvironment · Analyzing wafer handling characteristics by monitoring loading and unloading sequences · Supporting the alignment of the handling system · Fast detection of misaligned handling systems · Preventing further contamination and yield-endangering processing · Reduction of equipment downtime by narrowing down the root cause of a particle contamination · Opt imization of quartz ware recycling cycles by correlation of HandMon and wafer surface particle data · Saving of particle test wafers by a reliable ISPM application and stable processes HandMon-ISPM turned out to be a cost-effective and fast measurement system with economic potential. The costs of the components for this retrofit system amounts to 15.000 $ using standard equipment available on stock. Providing an integration of a HandMon system right from the design of a furnace keeps the costs in line more effective. The control of a HandMon system can be carried out by the furnace controller.enISPMhandling monitoringAEC/APC670620530conference paper