Under CopyrightSchletz, A.A.SchletzEndruschat, A.A.EndruschatHeckel, T.T.Heckel2022-03-1430.10.20202020https://publica.fraunhofer.de/handle/publica/40909510.24406/publica-fhg-409095enSiC power modulesGaNpower electronics packaging670620530presentation