Influence of assembly process - material properties and geometry on the reliability of flip chip interconnections on MID for automotive applications

Dreßler, M.M.DreßlerRohde, H.H.RohdeLiebing, G.G.LiebingBecker, K.-F.K.-F.BeckerWunderle, B.B.WunderleReichl, H.H.Reichl2022-03-102022-03-102006https://publica.fraunhofer.de/handle/publica/353887en621Influence of assembly process - material properties and geometry on the reliability of flip chip interconnections on MID for automotive applicationsconference paper