Lapisa, M.M.LapisaZimmer, F.F.ZimmerNiklaus, F.F.NiklausGehner, A.A.GehnerStemme, G.G.Stemme2022-03-112022-03-112009https://publica.fraunhofer.de/handle/publica/36562110.1109/MEMSYS.2009.48055562-s2.0-65949110371This paper presents a novel CMOS-compatible fabrication process and evaluations of a micro mirror array (MMA) made of mono-crystalline silicon (m-Si) for adaptive optic (AO) applications. The m-Si mirror layer is transfer bonded from a silicon-on-insulator (SOI) donor wafer with adhesive wafer bonding towards an intermediate patterned polymer spacer layer and clamped with metal plating. We present a CMOS compatible, bond alignment-free fabrication scheme offering the potential for high air gap distances between substrate and mirrors and we show first measurements of the fabricated mirrors. ©2009 IEEE.en621conference paper