Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology

Becker, K.-F.K.-F.BeckerAnsorge, F.F.AnsorgeEhrlich, R.R.EhrlichAzdasht, G.G.AzdashtBader, V.V.BaderAschenbrenner, R.R.AschenbrennerReichl, H.H.Reichl2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/3289612-s2.0-0031342010en621Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technologyconference paper