Bock, K.K.Bock2022-03-102022-03-102008https://publica.fraunhofer.de/handle/publica/360975Hybrid Fabrication Process for Organic Electronics; Background: Systems Integration on Foil Substrates; Selective Large Area Structurization and Nano; Nanotechnology in OLAE?; Surface functionalization for SA & bio-sensing; Self assembly for ?Bio? and electronic components; LA µ-CP for sub-µm OFET; NIL & Embossing; Plastic-MEMS & Bio-Chip;en621conference paper