Ourinson, DanielDanielOurinsonEmanuel, GernotGernotEmanuelCsordàs, AttilaAttilaCsordàsDammaß, GunnarGunnarDammaßMüller, HaraldHaraldMüllerSternkiker, ChristophChristophSternkikerClement, FlorianFlorianClementGlunz, Stefan W.Stefan W.Glunz2022-03-142022-03-142019https://publica.fraunhofer.de/handle/publica/40603210.1063/1.5125878In this work, an inline IR thermography system as an innovative application for real-time contactless temperature measurement of wafers - both metallized and non-metallized - during the firing process has been successfully realized in an industrial firing furnace as proof-of-concept and example for a thermography system in a conveyor furnace. As observed by the new system, thermocouples seem to measure lower temperature on wafers - especially in combination with thermocouple-frames - than wafers exhibit at standard firing conditions (here up to DT ≈ 40 K). Further, highly resolved spatial temperature distribution could be successfully measured on the wafer.enPhotovoltaikSilicium-PhotovoltaikMetallisierungStrukturierungFiringMeasurementThermographyAssuranceBelt Furnace621697In-Situ Wafer Temperature Measurement During Firing Process via Inline Infrared Thermographyconference paper