Weber, R.R.WeberFidorra, F.F.FidorraHamacher, M.M.HamacherHeidrich, H.H.HeidrichJacumeit, G.G.Jacumeit2022-03-082022-03-081993https://publica.fraunhofer.de/handle/publica/320518For the packaging of integrated InP devices the authors present two approaches, which rely on a passive fiber alignment. In one case the fibers are hold in V-grooves etched directly into the InP, alternatively, V-grooves are etched into Si and the InP chip is assembled by a self-aligning flip chip process.enflip-chip devicesiii-v semiconductorindium compoundsintegrated optoelectronicsmultichip moduleoptical couplersoptical fibrepackagingmulti fiber/chip couplingoptoelectronic integrated circuit packagingflip-chip bondingpassive fiber alignmentV-grooveintegrated InP device621conference paper