Wolf, H.H.WolfStreiter, R.R.StreiterRzehak, R.R.RzehakMeyer, F.F.MeyerSpringer, G.G.Springer2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/34924610.1016/j.mee.2005.07.0852-s2.0-28044464935We present an extension of the density-step height model for pattern effects in oxide CMP. The model is compared to polishing data for processes using different pressure and speed. Agreement with the data is improved especially in the initial regime of polishing before the pad contacts the down areas. Implications for process optimization are discussed.en621conference paper