Braun, T.T.BraunBecker, K.F.K.F.BeckerHölck, O.O.HölckVoges, S.S.VogesWöhrmann, M.M.WöhrmannBöttcher, L.L.BöttcherTöpper, M.M.TöpperStobbe, L.L.StobbeAschenbrenner, R.R.AschenbrennerSchneider-Ramelow, M.M.Schneider-RamelowLang, K.D.K.D.Lang2022-03-142022-03-142019https://publica.fraunhofer.de/handle/publica/40582910.23919/LTB-3D.2019.8735124Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistribution layer or package-on-package approaches also larger rectangular substrates formats are targeted.en621conference paper