Novel MEMS CSP to bridge the gap between development and manufacturing

Jung, E.E.JungWiemer, M.M.WiemerAschenbrenner, R.R.AschenbrennerFärber, A.A.Färber2022-03-102022-03-102004https://publica.fraunhofer.de/handle/publica/34462110.1109/ECTC.2004.13194362-s2.0-10444266637en621Novel MEMS CSP to bridge the gap between development and manufacturingconference paper