Computer aided optimization of advanced materials for liquid cooled printed circuit boards and their use in telecommunications

Kaulfersch, E.E.KaulferschMehlhorn, T.T.MehlhornTöpfer, M.M.TöpferReichl, H.H.Reichl2022-03-032022-03-031999https://publica.fraunhofer.de/handle/publica/196482en621Computer aided optimization of advanced materials for liquid cooled printed circuit boards and their use in telecommunicationsbook article