Seidel, K.K.SeidelWeinreich, WenkeWenkeWeinreichPolakowski, P.P.PolakowskiTriyoso, D.H.D.H.TriyosoNolan, M.G.M.G.NolanYiang, K.Y.K.Y.YiangChu, S.S.Chu2022-03-122022-03-122013https://publica.fraunhofer.de/handle/publica/38321010.1109/IIRW.2013.68041902-s2.0-84900510865The integration of passive devices on chip plays an important role in system miniaturization and enabling of future applications. In order to keep pace with the device scaling and reduction of chip area integrated MIM capacitors of enhanced capacitance density are required for supply buffering, decoupling or signal filtering.en621conference paper