21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020

2022-03-022022-03-022020978-1-7281-6049-8978-1-7281-6050-4https://publica.fraunhofer.de/handle/publica/16601021st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020