Under CopyrightFichtner, JulianeJulianeFichtnerDobeleit, PhilippPhilippDobeleitJaretzki, MartinMartinJaretzkiAscheri, Mary EstherMary EstherAscheriStoll, TobiasTobiasStoll2022-03-144.2.20202019https://publica.fraunhofer.de/handle/publica/40654810.24406/publica-fhg-406548enconductive pathssilvercopper3D Printingadditive manufacturinglaser curingLaser Sintering620670Printing and Laser Sintering of Ag and Cu Paste - Prospects and Challenges in Additive Manufacturingposter