Stieglitz, T.T.StieglitzSchüttler, M.M.SchüttlerBeutel, H.H.BeutelMeyer, J.-U.J.-U.Meyer2022-03-092022-03-092000https://publica.fraunhofer.de/handle/publica/337218en610620Electrode-Substrate-Package Co-Design for Implantable Biomedical Microdevicesconference paper