Kuhmann, J.F.J.F.KuhmannHensel, H.-J.H.-J.HenselPech, D.D.PechHarde, P.P.HardeBach, H.-G.H.-G.Bach2022-03-092022-03-091996https://publica.fraunhofer.de/handle/publica/32736310.1109/ECTC.1996.5508172-s2.0-0029696532The self-aligned flip-chip (FC) bonding technique is a very attractive means for the assembly of photonic devices containing multiple optical as well as electrical waveguide interconnects. In this article we propose a fluxless FC-bonding technology which nevertheless ensures efficient solder oxide reduction by applying molecular hydrogen (H2) under vacuum conditions. Bonding experiments were carried out in a newly developed FC-bonder of which some interesting details are reported. Reproducable bonding accuracies below the required tolerances for fiber to tapered waveguide coupling of <or=3 mu m have been achieved. Using eutectic tin-lead (SnPb 60/40) solder and platinum (Pt) as a wettable pad metallization these bonding results have been obtained at moderate temperatures (250 degrees C) and heating durations (2 min). An investigation on the oxidation kinetics of molten SnPb 60/40 solder confirms the ability of H2 to reduce solder oxides when thermodynamic boundary conditions are met. The leach resistance of the Pt thin-film metallization (300 nm) has been prooved by SIMS depth profiles for the required bonding temperatures and durations.enflip-chip devicesmetallisationoptical fabricationoptical waveguidesoxidationsolderingself-aligned fluxless flip-chip bonding technologyphotonic deviceoptical waveguide interconnectelectrical waveguide interconnectassemblyfiber to tapered waveguide couplingeutectic tin-lead solderoxidation kineticsthermodynamic boundary conditionsleach resistanceplatinum thin-film metallizationsims depth profile250 csnpbpth2621conference paper