Ndip, I.I.NdipJohn, W.W.JohnReichl, H.H.Reichl2022-03-102022-03-102004https://publica.fraunhofer.de/handle/publica/34463310.1109/EPTC.2004.1396687In order to efficiently design multilayered chip packages and boards for RF/high-speed applications, a comparative study of different via configurations, as well as appropriate design measures to prevent their parasitic effects from degrading the entire system performance is needed. In this paper, we present a comparison between buried, blind and through-hole vias based on their full-wave electromagnetic (EM) field simulation, equivalent circuit modeling and RF measurement results. From this comparison, design recommendations that can be used to reduce/eliminate signal degrading effects caused by these vias were deduced for frequencies up to 30GHz.en621conference paper