Wolf, J.J.WolfChmiel, G.G.Chmiel2022-03-082022-03-082007https://publica.fraunhofer.de/handle/publica/307758A solder storage carrier consists of metallic coating (12) on a substrate (11) with a mask (13) with openings (14) to receive the solder deposit (16). The coating consists of two layers of different material, the first (15) being a current-conducting layer (15) and the second (17) a non-wetting layer. The layer (15) is made of Cu (alloy) and the layer (17) of Ti (alloy). The cross-sectional area of the openings in the mask determine the max. cross-section of the solder deposits. By inverting the carrier over a substrate (21) to be coated, the solder deposits are transferred to produce the solder spots (22). USE - In selective coating of substrates to produce connection sites. ADVANTAGE - Enables the selective coating of large area substrates.de608621patent1995-19533169