2022-03-082022-03-082014https://publica.fraunhofer.de/handle/publica/310148The invention relates to a component with filament connection, in particular for communication, in particular for optical communication comprising: a voluminous material, a substrate, a filament and a connection component applied on the filament, where the filament has been embedded in the substrate and, at a transition point, emerges from the substrate and proceeds into the voluminous material. According to the invention, the voluminous material directly encloses the filament from the transition point and directly encloses the connection component applied on the filament and has full-area inseparable bonding to the substrate, where the voluminous material is a fully crosslinked voluminous material formed from a pliable material and the substrate has been hardened.de620patent102012216009