Hanf, MichaelMichaelHanfBrinkmann, AndreasAndreasBrinkmannDeißenberger, AndreaAndreaDeißenbergerKaminski, NandoNandoKaminskiStenzel, VolkmarVolkmarStenzel2024-09-122024-09-122024-09https://publica.fraunhofer.de/handle/publica/47517910.30420/566262043enDDC::500 Naturwissenschaften und MathematikCorrosion Resistant Packaging for Power Semiconductor Modules - Modified Insulation Materials for Contaminated Environmentsconference paper