Timoneda, X.X.TimonedaAbadal, S.S.AbadalCabellos-Aparicio, A.A.Cabellos-AparicioManessis, D.D.ManessisZhou, J.J.ZhouFranques, A.A.FranquesTorrellas, J.J.TorrellasAlarcon, E.E.Alarcon2022-03-142022-03-142018https://publica.fraunhofer.de/handle/publica/40726910.1109/ISCAS.2018.83518752-s2.0-85057092212Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM).en621conference paper