Wiesenfarth, MaikeMaikeWiesenfarthGuter, WolfgangWolfgangGuterHelmers, HenningHenningHelmers2022-03-082022-03-082011https://publica.fraunhofer.de/handle/publica/309639The invention relates to a semiconductor component having a multi-layer structure, wherein a bypass diode is monolithically integrated into the semiconductor component. The invention further relates to modules that are constructed from several of said semiconductor components. The invention relates in particular to multi-junction solar cells in photovoltaics.de621Halbleiterbauelement im Mehrschichtaufbau und hieraus gebildetes ModulSEMICONDUCTOR COMPONENT HAVING A MULTI-LAYER STRUCTURE AND MODULE FORMED THEREFROMpatent102011115340