Hofmann, ChristianChristianHofmannRochala, PatrickPatrickRochalaKroll, MartinMartinKrollPanhale, SushantSushantPanhaleBaum, MarioMarioBaumKuhn, HaraldHaraldKuhnOi, KiyoshiKiyoshiOiSanada, MasakiMasakiSanadaMurayama, KeiKeiMurayama2026-02-142026-02-1420239798350325157https://publica.fraunhofer.de/handle/publica/50674810.1109/ICSJ59341.2023.103395812-s2.0-85182019916This work presents a heating technology for multi-die attach based on inductive silver sintering. Thus, the heat for the sintering reaction is confined locally to the bond region, avoiding heating of the entire power module.enfalseinduction heatingpower electronic packagingsilver sinteringconference paper