Fiedler, H.H.FiedlerHermann, SaschaSaschaHermannSchulz, Stefan E.Stefan E.SchulzGeßner, ThomasThomasGeßner2022-03-112022-03-112011https://publica.fraunhofer.de/handle/publica/37151810.1109/IITC.2011.59403462-s2.0-80052070822For Cu/carbon nanotube(CNT) hybrid interconnect technology the growth of CNTs on a conductive substrate connected to Cu lines is required. CNTs were grown by catalytic chemical vapour deposition and the effect of a Cu layer beneath was investigated. By electron energy loss spectroscopy (EELS) we found the Cu to diffuse into the catalyst. This influences CNT growth. Therefore, incorporation of a sufficient diffusion barrier between the Cu layer and the substrate is required. As diffusion barriers we used Ta and TaN.enconference paper