Bose, I.R.I.R.BosePalavesam, N.N.PalavesamLandesberger, C.C.LandesbergerKutter, C.C.Kutter2022-03-052022-03-052018https://publica.fraunhofer.de/handle/publica/255363en621621Review of the Reliability of Flexible Packaging of Thin and Ultra-Thin ICsbook article