Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions

Dudek, R.R.DudekDöring, R.R.DöringMichel, B.B.MichelPicault, A.A.PicaultAutissier, J.-F.J.-F.Autissier2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/350336en621620Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditionsconference paper