Hegemann, D.D.HegemannOehr, C.C.OehrMueller, MichaelMichaelMueller2022-03-082022-03-082005https://publica.fraunhofer.de/handle/publica/306981Die Erfindung betrifft ein Verfahren zur Passivierung einer fuer die Verloetung vorgesehenen Endoberflaeche im Plasma sowie eine verbesserte passivierte Endoberflaeche, die durch dieses Verfahren erhaeltlich ist.EP 1544320 A UPAB: 20050823 NOVELTY - In a process to manufacture a microelectronic component, a surface is rendered passive and suitable for a soldering process. In the presence of a gas plasma, the surface is de-oxidised cleaned and covered by a passive coating agent in a single process. The passive coating is removable by a soldering process. Also claimed is a suitable microelectronic component. USE - Process to manufacture a microelectronic component. ADVANTAGE - The process replaces a multi-stage process with a single-stage process.de608610620660patent2003-10359371