Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects

Auersperg, J.J.AuerspergKlein, M.M.KleinMichel, B.B.Michel2022-03-102022-03-102007https://publica.fraunhofer.de/handle/publica/35723510.1109/ICEPT.2007.4441403en621Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspectsconference paper