Embedded die packages and modules for power electronics applications

Boettcher, L.L.BoettcherKaraszkiewicz, S.S.KaraszkiewiczManessis, D.D.ManessisOstmann, A.A.Ostmann2022-03-132022-03-132016https://publica.fraunhofer.de/handle/publica/397054enEmbedded die packages and modules for power electronics applicationsconference paper