Magnien, J.J.MagnienMitterhuber, L.L.MitterhuberRosc, J.J.RoscSchrank, F.F.SchrankHörth, S.S.HörthHutter, M.M.HutterDefregger, S.S.DefreggerKraker, E.E.Kraker2022-03-052022-03-052018https://publica.fraunhofer.de/handle/publica/25623610.1016/j.microrel.2018.01.005In this paper, a parameter driven monitoring model is introduced, in which a flip-chip LED module was investigated during a power cycling test. This approach was investigated to develop a monitoring model to describe thermally induced solder fatigue as root cause of flip-chip failure in a power cycling test. As monitoring parameter the thermal resistance of the LED module was used, which was determined by thermal impedance measurements of the whole LED module, as well as for each LED chip itself. Further analyses of the occurring temperature at the LED junction recorded of each chip during the power cycling test were used to generate a prediction model. The evaluation of the temperature change allowed to forecast the number of cycles until failure.en621journal article