Hennemann, O.-D.O.-D.Hennemann2022-03-032022-03-031990https://publica.fraunhofer.de/handle/publica/179387In the associated partners' research project "Adhesive bonding technologies in the electronics" the companies SEL and Degussa together with the Fraunhofer-Institut für Angewandte Materialforschung (IFAM), Bremen, have tested an alternative joining technology to soldering, the conductive adhesive bonding of surface mountable components with conductor tracks of printed circuit boards and/or thick films connections and transferred them into the manufacturing process. It was the main task of the IFAM to describe the ageing phenomenons and to give a system to this if possible. To manage this it was necessary to elaborate a suitable analytic and to adapt it to the changing requirements during the project. The elaborated statements are written down in this article. They were applied when formulating optimized adhesive products.deKlebstoffLangzeitbeständigkeitLeitfähigkeitOberflächenmontageSilberdiffusionSilberflake620660671journal article