Knüwer, M.M.KnüwerWichmann, K.-H.K.-H.WichmannMeinhardt, M.M.Meinhardt2022-03-092022-03-092000https://publica.fraunhofer.de/handle/publica/336175en620660671Tungsten- and molybdenum-copper alloys for microelectronic packagingconference paper