Under CopyrightDöge, JensJensDögeHoppe, C.C.HoppeReichel, P.P.ReichelPeter, N.N.PeterReichel, A.A.ReichelSkubich, C.C.Skubich2022-03-1526.1.20222021https://publica.fraunhofer.de/handle/publica/41348510.24406/publica-fhg-413485This paper presents a monolithic high-speed VSoC (Vision-System-on-Chip) with three software-programmable 16-bit ASIPs (application-specific instruction-set processors), a 1024-fold column-parallel data path of charge-based convolution functionality, freely configurable A/D conversion, 8-bit processor elements with 128 bytes of RAM each, and asynchronously compressing output of sparse column data. While 3D integration allows for combining a sensor field in optimal technology with a digital processing chip, it increases chip development, manufacturing and testing costs. In this design, the classical monolithic integration approach is pursued to achieve a single-chip solution with good fill factor and competitive performance in a classical 180 nm 1P6M CIS technology. To demonstrate the advantageous compressed sensing approach for fast and low-latency image processing, an algorithm for laser sheet-of-light triangulation was implemented.en621004presentation