May, D.D.MayWunderle, BernhardBernhardWunderleSchacht, R.R.SchachtMichel, BerndBerndMichel2022-03-122022-03-122013https://publica.fraunhofer.de/handle/publica/38229610.1109/EuroSimE.2013.6529959New packaging technologies are necessary to meet the demand for smaller and more reliable electronic devices. The so-called system-in-package (SiP) concept brings different technologies, material combinations and processes together in one package. To ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed.enconference paper