Under CopyrightBayer, Christoph F.Christoph F.Bayer2022-03-137.8.20182018https://publica.fraunhofer.de/handle/publica/40107110.24406/publica-fhg-401071enpower electronics packagingdouble sided coolingselectively sinteringceramic embedding670620530Power electronics packaging at Fraunhofer IISBpresentation