Trieb, RobertRobertTriebHeinig, AndyAndyHeinig2022-08-172022-08-172022-06-01https://publica.fraunhofer.de/handle/publica/41986010.1109/ECTC51906.2022.00051The aim of the paper is to demonstrate the feasibility of a chip-to-package co-design accounting for the chippackage copper pillar connection. Therefore, a 180° ring hybrid coupler was developed integrated in a wafer-level package with an on-chip termination for an application in the 60GHz WiGig range. Keywords-mm-wave communication, system-in-package, inpackage power divider, chip-package co-design.enmm-wave communicationsystem-in-packagein-package power dividerchip-package co-designDDC::000 Informatik, Informationswissenschaft, allgemeine Werkeconference paper