Koidl, P.P.KoidlWild, C.C.WildWörner, E.E.Wörner2022-03-082022-03-082001https://publica.fraunhofer.de/handle/publica/304890The diamond body (12) contains at least one longitudinal recess (13,15), extending at an angle to mechanical stresses induced by coupling to each heat source (30). Pref. a number of recesses extend obliquely to a heat flow direction induced by at least one heat source and/or heat sink. The number of the recesses may be so aligned w.r.t. each heat source and/or heat sink that the alignment angles to the mechanical stresses are larger than those to the heat flow directions. Typically the recesses are aligned orthogonally to the mechanical stresses. ADVANTAGE - Reduced danger of connection loosening or diamond body destruction by thermally induced mechanical stresses.de608621667DiamantkoerperDiamond body for thermal contacting heat source(s) for efficient heat dissipation of semiconductor power modules - contains longitudinal recesses angularly extending w.r.t. mechanical stresses thermally induced by heat source(s).patent1997-19701680