Lin, Y.-C.Y.-C.LinWang, W.-S.W.-S.WangChen, L.Y.L.Y.ChenChen, M.W.M.W.ChenGeßner, ThomasThomasGeßnerEsashi, M.M.Esashi2022-03-112022-03-112011https://publica.fraunhofer.de/handle/publica/37308910.1109/TRANSDUCERS.2011.5969554In this study, anodically-bondable LTCC (low temperature cofired ceramic) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. On-chip MEMS compatible fabrication of nanoporous gold (NPG) was developed and its porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. A MEMS integrated Si substrate is mechanically sealed to a metal feedthrough LTCC substrate by anodic bonding and its electrical connection is formed by the nanoporous structured pads simultaneously.enconference paper